Sockets provided by SER Corporation are solder-less IC socket, “No need solder”, and they can work with various type of IC package such as BGA, FBGA, CSP , LGA and QFP.

Regarding solder-less structure which can use contact terminal for double sides probe, you don’t need any solder.

Probes used with socket meet with pitches on LSI package, the pitches are from 0.40 to 1.27mm which have quite contact reliability and high frequency.

There are 2 types of IC socket; one is for IC production which needs high endurance for ATE, the other is evaluation manual test for IC development.

Burn-in socket can be operated with temperature “−40℃ to ＋150℃”.

SER’s sockets can design and produce any types of application with best structure, characteristic and performance.