Probe Card Socket for WLCSP
Product Outline
Vertical probe card socket for WLCSP that uses spring probes for the contacts.
SER recommends the most suitable probe tip shape and material for solder bump/ball terminals and achieves high durability of 3 million times in the mass production test process.
SER recommends the most suitable probe tip shape and material for solder bump/ball terminals and achieves high durability of 3 million times in the mass production test process.
It is possible to make Kelvin contact for narrow pitches of 150 μm or less and solder balls by using a fine pitch probe,
Multi-DUT testing is possible, contributing to reduce the test time.
It can also be used as debug socket with some other socket parts.
Multi-DUT testing is possible, contributing to reduce the test time.
It can also be used as debug socket with some other socket parts.
Features
- Vertical probe card with spring probes.
- Selectable crown / flat shape suitable for solder bumps/balls, Pd alloy material, and other special coatings.
- It is also possible to measure Kelvin for narrow pitches of 150 μm or less and solder balls.
150μm pitch Probe unit
Probe card for WLCSP
example : the socket parts to measure as debugging.