Fine Pitch Probe
Product Outline
In the semiconductor test process, the PAD pitch becomes smaller, fine-pitch probes are required to support that. SER offers fine pitch probes which have barrel diameters of φ150 μm, φ108 μm, and φ88 μm. These products can be used as a probe card contact for wafer testing, and multi-DUT testing for WLCSP devices.
Features
- Support fine pitch down to 120 μm.
- Various tip shapes and materials can be selected based on target devices, such as crowns for solder bumps and needle shapes for pads.
- Ideal for vertical probe card for WLCSP devices.
φ150μm
φ108μm
φ88μm
